INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY"

GENEVA, Dec. 24 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/033099) for "ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY" on Jun 10, 2025. With publication no. WO/2025/259730, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHADHA, Arvinder Manmohan Singh (3050 Bowers AvenueSanta Clara, California 95054)

Abstract: A substrate support assembly includes a cooling plate. The substrate support assembly further includes a chuck disposed on the coolin...