INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "DISTINGUISHED FLIP CHIP PACKAGING FOR STRESS RELAXATION AND ENHANCED EM PROTECTION"

GENEVA, Aug. 19 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/013704) for "DISTINGUISHED FLIP CHIP PACKAGING FOR STRESS RELAXATION AND ENHANCED EM PROTECTION" on Jan 30, 2025. With publication no. WO/2025/170813, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AGRAWAL, Akash (3050 Bowers AvenueSanta Clara, California 95054), KHASGIWALA, Mudit Sunilkumar (3050 Bowers AvenueSanta Clara, California 95054)

Abstract: Exemplary flip chip packages may inclu...