INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "DIELECTRIC BOND LAYER FOR JOINING OF DISSIMILAR CERAMIC SEGMENTS OF A SUBSTRATE SUPPORT"

GENEVA, Dec. 31 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/033809) for "DIELECTRIC BOND LAYER FOR JOINING OF DISSIMILAR CERAMIC SEGMENTS OF A SUBSTRATE SUPPORT" on Jun 16, 2025. With publication no. WO/2025/264576, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAVAKOLI, Amir H. (c/o Applied Materials, Inc.Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054), LI, Jian (c/o Applied Materials, Inc.Law Dept., M/S 12693050 Bowers AvenueSa...