INTERNATIONAL PATENT: APPLIED MATERIALS, INC., NATIONAL UNIVERSITY OF SINGAPORE FILES APPLICATION FOR "METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMICONDUCTOR DEVICES"

GENEVA, June 25 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054), NATIONAL UNIVERSITY OF SINGAPORE (21 Lower Kent Ridge RoadSingapore 119077) filed a patent application (PCT/US2024/060006) for "METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMICONDUCTOR DEVICES" on Dec 13, 2024. With publication no. WO/2025/128978, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHUA, Zhijie (Applied Materials Singapore Technology Pte Ltd10 Science Park Road, #02-03, The Alpha Science Park IISi...