GENEVA, May 14 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054), NANYANG TECHNOLOGICAL UNIVERSITY (50 Nanyang Avenue639798 Singapore) filed a patent application (PCT/US2024/051554) for "SELECTIVE DIELECTRIC CAPPING FOR HYBRID BONDING" on Oct 16, 2024. With publication no. WO/2025/096196, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIANTO, Prayudi (10 Science Park Road #02-03The Alpha Science Park IISingapore 117684), TAN, Chuan Seng (School of Electrical and Electronic EngineeringNanyang Te...