GENEVA, Oct. 5 -- APPLIED ANGSTROM TECHNOLOGY PTE. LTD. (Blk 81 Ayer Rajah Crescent#03-41Singapore 139967Singapore) filed a patent application (PCT/SG2024/050196) for "HIGH THERMAL RESISTANCE SANDWICHED STRUCTURE AND FORMATION FOR ELECTROSTATIC CHUCKS" on Mar 28, 2024. With publication no. WO/2025/207020, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YANG, Deng Liang (Blk 81 Ayer Rajah Crescent#03-41Singapore 139967)
Abstract: The present invention includes a thermal resistant sandwiched structure and formation for ele...