GENEVA, Oct. 6 -- APPLE INC. (One Apple Park WayCupertino, California 95014) filed a patent application (PCT/US2025/019711) for "HIGH BANDWIDTH MEMORY BUFFER BRIDGE DIE IN ROUTING SUBSTRATE" on Mar 13, 2025. With publication no. WO/2025/207325, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ZHAI, Jun (One Apple Park WayCupertino, California 95014)
Abstract: Memory systems and methods of assembly are described in which a memory system includes a routing substrate, a processor on a first side of the routing substrate, a m...