INTERNATIONAL PATENT: AMS-OSRAM INTERNATIONAL GMBH FILES APPLICATION FOR "COMPONENT PACKAGE HAVING A HYBRID SEMICONDUCTOR CHIP"

GENEVA, June 16 -- AMS-OSRAM INTERNATIONAL GMBH (Leibnizstr. 493055 Regensburg) filed a patent application (PCT/EP2024/084926) for "COMPONENT PACKAGE HAVING A HYBRID SEMICONDUCTOR CHIP" on Dec 05, 2024. With publication no. WO/2025/120086, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SORG, Joerg Erich (Gozratstr. 1293053 Regensburg)

Abstract: The invention relates to a component package, in particular a laser package, comprising a first semiconductor chip having a first main face and a second main face opposite the ...