INTERNATIONAL PATENT: AMS-OSRAM AG FILES APPLICATION FOR "WAFER CHUCK, ARRANGEMENT AND METHOD FOR OPERATING AN ARRANGEMENT"

GENEVA, April 6 -- AMS-OSRAM AG (SchloB PremstaettenTobelbader Str. 308141 Premstaetten) filed a patent application (PCT/EP2024/076773) for "WAFER CHUCK, ARRANGEMENT AND METHOD FOR OPERATING AN ARRANGEMENT" on Sep 24, 2024. With publication no. WO/2025/068175, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FRAISS, Gottfried (Klein-Veitsch-Strasse 698663 Veitsch)

Abstract: A wafer chuck is provided, comprising : a plate, and a further plate, wherein the plate comprises a mounting surface for attaching a wafer, the furt...