INTERNATIONAL PATENT: AMPHENOL CORPORATION FILES APPLICATION FOR "HIGH RELIABILITY CO-PACKAGED ELECTRONIC ASSEMBLY AND BGA-SUPPORT"

GENEVA, Nov. 19 -- AMPHENOL CORPORATION (358 Hall AvenueWallingford, CT 06492) filed a patent application (PCT/US2025/028747) for "HIGH RELIABILITY CO-PACKAGED ELECTRONIC ASSEMBLY AND BGA-SUPPORT" on May 09, 2025. With publication no. WO/2025/235953, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MILBRAND, Donald W. Jr. (22 Hemp Hill RoadBristol, NH 03222), REN, Huilin (15 Tinker RoadMerrimack, NH 03054), CALDERON, Barbara (162A Pine Hill Rd.Chelmsford, MA 01824), GIRARD, Donald A. Jr. (27 Gage RoadBedford, NH 03110)

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