INTERNATIONAL PATENT: AMCOR RIGID PACKAGING USA, LLC FILES APPLICATION FOR "TWO-STEP HDPE PREFORM AND CONTAINER WITH LOW AXIAL STRETCH RATIO"

GENEVA, June 18 -- AMCOR RIGID PACKAGING USA, LLC (935 Technology DriveAnn Arbor, Michigan 48108) filed a patent application (PCT/US2023/082658) for "TWO-STEP HDPE PREFORM AND CONTAINER WITH LOW AXIAL STRETCH RATIO" on Dec 06, 2023. With publication no. WO/2025/122144, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WURSTER, Michael (1016 Sylvan Rd.Chelsea, Michigan 48118)

Abstract: A method for forming a container from a high-density polyethylene preform by one-step or two-step injection stretch blow molding. The meth...