GENEVA, Nov. 4 -- AMCOR RIGID PACKAGING USA, LLC (935 Technology DriveAnn Arbor, Michigan 48108) filed a patent application (PCT/US2024/025768) for "PREFORM AND CONTAINER INCLUDING BASE RINGS" on Apr 23, 2024. With publication no. WO/2025/226259, the details related to the patent application was published on Oct 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LANE, Michael T. (556 Timber LnBrooklyn, Michigan 49230), STELZER, James (10184 Aylebury DriveSouth Lyon, Michigan 48178)
Abstract: A preform configured to be molded into a container including: a finish defining an opening; a tip d...