INTERNATIONAL PATENT: AMCOR FLEXIBLES NORTH AMERICA, INC. FILES APPLICATION FOR "THERMOFORMABLE BASE FILM, THERMOFORMED BASE AND PACKAGED PRODUCT"

GENEVA, Oct. 28 -- AMCOR FLEXIBLES NORTH AMERICA, INC. (Office of Intellectual Property CounselP.O. Box 669Neenah, WI 54957) filed a patent application (PCT/US2024/024595) for "THERMOFORMABLE BASE FILM, THERMOFORMED BASE, AND PACKAGED PRODUCT" on Apr 15, 2024. With publication no. WO/2025/221233, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ONGENAE, Emiel (Office of Intellectual Property CounselP.O. Box 669Neenah, Wisconsin 54957), DE SCHOENMAKER, Bert (Office of Intellectual Property CounselP.O. Box 669Neenah, Wiscons...