GENEVA, Dec. 16 -- AMCOR FLEXIBLES NORTH AMERICA, INC. (2301 Industrial DriveNeenah, Wisconsin 54956) filed a patent application (PCT/US2024/032803) for "PACKAGING FILM AND PACKAGE" on Jun 06, 2024. With publication no. WO/2025/254655, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): THEOBALD, Tyler J. (Office of Intellectual Property CounselP.O. Box 669Neenah, Wisconsin 54957), MCLAMB, Mason C. (Office of Intellectual Property CounselP.O. Box 669Neenah, Wisconsin 54957)

Abstract: A packaging film is disclosed. The packag...