GENEVA, June 12 -- AMCOR FLEXIBLES NORTH AMERICA, INC. (2301 Industrial DriveNeenah, Wisconsin 54956) filed a patent application (PCT/US2025/018225) for "MULTILAYER PACKAGING FILM WITH POLYPROPYLENE AND POLYETHYLENE" on Mar 03, 2025. With publication no. WO/2025/117993, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BERBERT, Otacilio T. (Office of Intellectual Property CounselP.O. Box 669Neenah, Wisconsin 54957), BOBKO, Brett P. (Office of Intellectual Property CounselP.O. Box 669Neenah, Wisconsin 54957), COOLICH, Meliss...