INTERNATIONAL PATENT: AMCOR FLEXIBLES NORTH AMERICA, INC. FILES APPLICATION FOR "LAP-SEALABLE POLYETHYLENE FILMS AND SEALED PACKAGES"

GENEVA, Oct. 5 -- AMCOR FLEXIBLES NORTH AMERICA, INC. (2301 Industrial DriveNeenah, Wisconsin 54956) filed a patent application (PCT/US2024/021339) for "LAP-SEALABLE POLYETHYLENE FILMS AND SEALED PACKAGES" on Mar 25, 2024. With publication no. WO/2025/207077, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DRANEBOIS, Clemence (Office of Intellectual Property CounselP.O. Box 669Neenah, Wisconsin 54957), CHAPALAIN, Florian (Office of Intellectual Property CounselP.O. Box 669Neenah, Wisconsin 54957), LOMASOV, Nikolai (Office...