INTERNATIONAL PATENT: ALPHA ASSEMBLY SOLUTIONS INC., SETNA, ROHAN P. FILES APPLICATION FOR "SOLDER JOINT COMPRISING A TIN ALLOY AND AN ENCAPSULANT COMPRISING SILICA PARTICLES IN AN EPOXY RESIN AND ELECTRONIC DEVICE"

GENEVA, June 30 -- ALPHA ASSEMBLY SOLUTIONS INC. (245 Freight StreetWaterbury, CT 06702), SETNA, Rohan P. (c/o BOULT WADE TENNANT LLPSalisbury Square House8 Salisbury SquareLondon EC4Y 8AP) filed a patent application (PCT/EP2024/025352) for "SOLDER JOINT COMPRISING A TIN ALLOY AND AN ENCAPSULANT COMPRISING SILICA PARTICLES IN AN EPOXY RESIN, AND ELECTRONIC DEVICE" on Dec 20, 2024. With publication no. WO/2025/131329, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHOUDHURY, Pritha (c/o Alpha Assembly Solutions Inc., 245 ...