INTERNATIONAL PATENT: ALPHA ASSEMBLY SOLUTIONS INC., SETNA, ROHAN P. FILES APPLICATION FOR "SINTERING COMPOSITION BASED ON COPPER PARTICLES"

GENEVA, Nov. 24 -- ALPHA ASSEMBLY SOLUTIONS INC. (245 Freight StreetWaterbury, Connecticut 06702), SETNA, Rohan P. (c/o Boult Wade Tennant LLPSalisbury Square House8 Salisbury SquareLondon EC4Y 8AP) filed a patent application (PCT/EP2025/063444) for "SINTERING COMPOSITION BASED ON COPPER PARTICLES" on May 15, 2025. With publication no. WO/2025/238173, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHAKI, Nirmalya Kumar (c/o Alpha Assembly Solutions Inc., 245 Freight StreetWaterbury, Connecticut 06702), KUNDU, Manas Kumar...