INTERNATIONAL PATENT: ALPHA ASSEMBLY SOLUTIONS INC., SETNA, ROHAN P. FILES APPLICATION FOR "METHOD OF FORMING A SINTERING POWDER COMPRISING COPPER PARTICLES"

GENEVA, Oct. 13 -- ALPHA ASSEMBLY SOLUTIONS INC. (245 Freight StreetWaterbury, CT 06702), SETNA, Rohan P. (c/o Boult Wade Tennant LLPSalisbury Square House8 Salisbury SquareLondon, EC4Y 8AP) filed a patent application (PCT/EP2024/025244) for "METHOD OF FORMING A SINTERING POWDER COMPRISING COPPER PARTICLES" on Aug 08, 2024. With publication no. WO/2025/209640, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHAKI, Nirmalya Kumar (c/o Alpha Assembly Solutions Inc., 245 Freight StreetWaterbury, CT 06702), KUNDU, Manas Kumar...