GENEVA, Aug. 19 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), ＡＧＣ株式会社 (東京都千代田区丸の内一丁目５番１号) filed a patent application (PCT/JP2025/004159) for "SOLID COMPOSITION FOR PRODUCING HOLLOW MOLDED ARTICLE, HOLLOW MOLDED ARTICLE, AND ELECTRIC WIRE COATING MATERIAL" on Feb 07, 2025. With publication no. WO/2025/170049, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIP...