GENEVA, Dec. 16 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), AGC株式会社 (東京都千代田区丸の内一丁目5番1号) filed a patent application (PCT/JP2025/020160) for "SOLID COMPOSITION, EXTRUSION MOLDED ARTICLE, BLOW MOLDED ARTICLE, TRANSFER MOLDED ARTICLE, PRESS MOLDED ARTICLE, INJECTION MOLDED ARTICLE, COATED ELECTRIC WIRE, AND MOLDED ARTICLE" on Jun 04, 2025. With publication no. WO/2025/254138, the details related to the patent application was published on Dec 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, wh...