INTERNATIONAL PATENT: AGC INC., ＡＧＣ株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE"

GENEVA, May 5 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), ＡＧＣ株式会社 (東京都千代田区丸の内一丁目５番１号) filed a patent application (PCT/JP2024/036201) for "RESIN COMPOSITION, HEAT DISSIPATION DEVICE, AND ELECTRONIC DEVICE" on Oct 09, 2024. With publication no. WO/2025/089080, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FUJIOKA Osamu (c/o AGC Inc., 5-...