GENEVA, March 10 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), AGC株式会社 (東京都千代田区丸の内一丁目5番1号) filed a patent application (PCT/JP2024/030530) for "COPOLYMER, COMPOSITION, EXTRUSION MOLDED ARTICLE, BLOW MOLDED ARTICLE, TRANSFER MOLDED ARTICLE, COATED ELECTRIC WIRE, AND MOLDED ARTICLE" on Aug 27, 2024. With publication no. WO/2025/047750, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...