INTERNATIONAL PATENT: ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "STACKED DIE EXTENSION OVER PROCESSOR CORE"

GENEVA, Oct. 6 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine Dr.Santa Clara, California 95054) filed a patent application (PCT/US2025/017327) for "STACKED DIE EXTENSION OVER PROCESSOR CORE" on Feb 26, 2025. With publication no. WO/2025/207255, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MOYER, Paul James (6232 Treestead CtFort Collins, Colorado 80528), OLIVER, Christopher Spence (6801 Tanaqua LaneAustin, Texas 78739), KALAMATIANOS, John (2 Hemlock StreetArlington, Massachusetts 02474)

Abstract: A stacked die extens...