INTERNATIONAL PATENT: ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "INTEGRATED CIRCUIT DIE STACK WITH A DUAL-SIDED BRIDGE DIE"

GENEVA, Aug. 5 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2024/054594) for "INTEGRATED CIRCUIT DIE STACK WITH A DUAL-SIDED BRIDGE DIE" on Nov 05, 2024. With publication no. WO/2025/159812, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ALAM, Arsalan (7171 Southwest PkwyAustin, Texas 75735), MANDALAPU, Chandra Sekhar (7171 Southwest PkwyAustin, Texas 75735), WANG, Liwei (7171 Southwest PkwyAustin, Texas 75735), DUBEY, Manish (7171 Southwest PkwyAus...