INTERNATIONAL PATENT: ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "HYBRID BONDED INVERTED MEMORY-LOGIC STACK"

GENEVA, May 27 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2024/033234) for "HYBRID BONDED INVERTED MEMORY-LOGIC STACK" on Jun 10, 2024. With publication no. WO/2025/106123, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LOH, Gabriel (2002 - 156th Ave. NE Suite 300Bellevue, Washington 98007)

Abstract: Memory layers and a digital device layer are configured into a three-dimensional integrated circuit (IC) die stack. The digital device layer (304)...