GENEVA, April 21 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2024/035354) for "CHIP PACKAGE WITH MULTIPLE HBM STACKS" on Jun 25, 2024. With publication no. WO/2025/080316, the details related to the patent application was published on Apr 17, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WILKERSON, Brett P. (7171 Southwest PkwyAustin, Texas 78735), SMITH, Alan D. (7171 Southwest PkwyAustin, Texas 78735)
Abstract:
Disclosed herein are chip packages that integrate multiple compute dies through a single interposer di...