INTERNATIONAL PATENT: ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "CHIP PACKAGE WITH ACTIVE SILICON BRIDGE"

GENEVA, May 19 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2024/033342) for "CHIP PACKAGE WITH ACTIVE SILICON BRIDGE" on Jun 11, 2024. With publication no. WO/2025/101227, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KULKARNI, Deepak Vasant (7171 Southwest PkwyAustin, Texas 78735), SMITH, Alan D. (7171 Southwest PkwyAustin, Texas 78735), SWAMINATHAN, Raja (7171 Southwest PkwyAustin, Texas 78735)

Abstract: Disclosed herein are chip packages and...