GENEVA, Oct. 19 -- ADEKA CORPORATION (2-35, Higashiogu 7-chome, Arakawa-ku, Tokyo1168554), 株式会社ＡＤＥＫＡ (東京都荒川区東尾久七丁目２番３５号) filed a patent application (PCT/JP2025/013804) for "RESIN COMPOSITION, MOLDED ARTICLE, METHOD FOR PRODUCING RESIN COMPOSITION, RESIN ADDITIVE COMPOSITION, AND METHOD FOR THERMALLY STABILIZING SYNTHETIC RESIN" on Apr 04, 2025. With publication no. WO/2025/216199, the details related to the patent application was published on Oct 16, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...