INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "VIA REVEAL PROCESSING AND STRUCTURES"

GENEVA, July 10 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2024/052665) for "VIA REVEAL PROCESSING AND STRUCTURES" on Oct 23, 2024. With publication no. WO/2025/144497, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): UZOH, Cyprian, Emeka (c/o Adeia Semiconductor Bonding Technologies Inc.3025 Orchard ParkwaySan Jose, California 95134), FOUNTAIN, Gaius, Gillman, Jr. (c/o Adeia Semiconductor Bonding Technologies Inc.3025 Orchard ParkwayS...