INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "STACKED INTERCONNECT STRUCTURES AND METHODS OF FORMING THE SAME"

GENEVA, Oct. 6 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/021400) for "STACKED INTERCONNECT STRUCTURES AND METHODS OF FORMING THE SAME" on Mar 25, 2025. With publication no. WO/2025/207675, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HABA, Belgacem (3025 Orchard ParkwaySan Jose, California 95134), KATKAR, Rajesh (3025 Orchard ParkwaySan Jose, California 95134)

Abstract: An interconnect structure includes a first substrate wi...