INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "PAD-LESS HYBRID BONDING"

GENEVA, Dec. 10 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/029141) for "PAD-LESS HYBRID BONDING" on May 13, 2025. With publication no. WO/2025/250349, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KATKAR, Rajesh (3025 Orchard ParkwaySan Jose, California 95134), FOUNTAIN, Gaius, Gillman, Jr. (3025 Orchard ParkwaySan Jose, California 95134), HABA, Belgacem (3025 Orchard ParkwaySan Jose, California 95134), UZOH, Cyprian, Emeka (30...