INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "METHODS AND APPARATUS FOR COOLING DIE STACKS"

GENEVA, Dec. 10 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/029140) for "METHODS AND APPARATUS FOR COOLING DIE STACKS" on May 13, 2025. With publication no. WO/2025/250348, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HABA, Belgacem (3025 Orchard ParkwaySan Jose, California 95134), KATKAR, Rajesh (3025 Orchard ParkwaySan Jose, California 95134)

Abstract: An electronics package can comprise a first die, a cooling element dispos...