INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "LIQUID AND AIR COMBO COOLING FOR MULTI-CHIP MODULES"

GENEVA, Oct. 6 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/020291) for "LIQUID AND AIR COMBO COOLING FOR MULTI-CHIP MODULES" on Mar 17, 2025. With publication no. WO/2025/207361, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHANG, Ron (3025 Orchard ParkwaySan Jose, California 95134), FOUNTAIN, Gaius Gillman, Jr. (3025 Orchard ParkwaySan Jose, California 95134), HABA, Belgacem (3025 Orchard ParkwaySan Jose, California 95134), KA...