INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "INTEGRATED MULTI-LEVEL COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME"

GENEVA, Aug. 19 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/015129) for "INTEGRATED MULTI-LEVEL COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME" on Feb 07, 2025. With publication no. WO/2025/171347, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HABA, Belgacem (3025 Orchard ParkwaySan Jose, California 95134), KATKAR, Rajesh (3025 Orchard ParkwaySan Jose, California 95134), VARIOT, Patrick J....