INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "INTEGRATED COOLING ASSEMBLY HAVING COOLING CHANNEL SHAPE WITH NEARLY CONSTANT CROSS SECTIONAL AREA"

GENEVA, Oct. 28 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/024801) for "INTEGRATED COOLING ASSEMBLY HAVING COOLING CHANNEL SHAPE WITH NEARLY CONSTANT CROSS SECTIONAL AREA" on Apr 15, 2025. With publication no. WO/2025/221812, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FOUNTAIN, Gaius Gillman, Jr. (3025 Orchard ParkwaySan Jose, California 95134), MROZEK, Pawel (3025 Orchard ParkwaySan Jose, California 95134), HUDSON, George C...