INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "HYBRID BONDING IN TOPOGRAPHIC PACKAGES"

GENEVA, Nov. 11 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/026878) for "HYBRID BONDING IN TOPOGRAPHIC PACKAGES" on Apr 29, 2025. With publication no. WO/2025/231024, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): UZOH, Cyprian, Emeka (3025 Orchard ParkwaySan Jose, California 95134)

Abstract: Electronic components and methods. The electronic components include a first device die and a first dummy die located in the first device ...