INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "FABRICATION METHODS AND STRUCTURES FOR LIQUID COOLING CHANNEL CHIP"

GENEVA, Aug. 19 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/015119) for "FABRICATION METHODS AND STRUCTURES FOR LIQUID COOLING CHANNEL CHIP" on Feb 07, 2025. With publication no. WO/2025/171337, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FOUNTAIN, Gaius Gillman, Jr. (3025 Orchard ParkwaySan Jose, California 95134), HABA, Belgacem (3025 Orchard ParkwaySan Jose, California 95134), HUDSON, George Carlton (3025 Orchard ParkwaySan...