INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "COOLING ASSEMBLIES FOR HANDHELD DEVICES"

GENEVA, Oct. 6 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/021639) for "COOLING ASSEMBLIES FOR HANDHELD DEVICES" on Mar 26, 2025. With publication no. WO/2025/207827, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HABA, Belgacem (3025 Orchard ParkwaySan Jose, California 95134)

Abstract: Embodiments herein provide for cooling assemblies provided within a handheld device. In one embodiment, a handheld device comprises a casing, a ...