INTERNATIONAL PATENT: 3D SYSTEMS, INC. FILES APPLICATION FOR "APPARATUS AND METHOD FOR ACCURATELY LEVELING A BUILD PLATE"

GENEVA, April 21 -- 3D SYSTEMS, INC. (333 Three D Systems CircleRock Hill, SC 29730) filed a patent application (PCT/US2024/047590) for "APPARATUS AND METHOD FOR ACCURATELY LEVELING A BUILD PLATE" on Sep 20, 2024. With publication no. WO/2025/080394, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUBER, John, Michael (1237 Via ConejoEscondido, CA 92029)

Abstract: A 3D printing system includes a resin vessel, a build plate positioning mechanism, a plurality of lower datums, and a build plate. The build plate positionin...