GENEVA, Feb. 24 -- 3D PLUS (408 rue Helene Boucher78530 BUC Cedex) filed a patent application (PCT/EP2024/072499) for "ENCAPSULATED MAGNETIC COMPONENT" on Aug 08, 2024. With publication no. WO/2025/036820, the details related to the patent application was published on Feb 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): COLONNA, Cedric (14 place Olomouc92160 ANTONY)
Abstract:
The invention relates to a magnetic component comprising: - an active portion comprising: o a printed circuit board extending along a first plane; o a first inductive element formed by a first winding of an electr...