GENEVA, Feb. 24 -- 3D PLUS (408 rue Helene Boucher78530 BUC Cedex) filed a patent application (PCT/EP2024/072573) for "ELECTRONIC MODULE COMPRISING A MODULAR HEAT DISSIPATION DEVICE" on Aug 09, 2024. With publication no. WO/2025/036837, the details related to the patent application was published on Feb 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): COLONNA, Cedric (14 place Olomouc92160 ANTONY)
Abstract:
The invention relates to an electronic device (1) comprising: - an electronic module (2) comprising a first face (20) and a second face (21), the electronic module (2) comprising n o...