INTERNATIONAL PATENT: 3D-MICROMAC AG FILES APPLICATION FOR "METHOD FOR PRODUCING A MICROSTRUCTURED COMPONENT HAVING A LAYER STRUCTURE"

GENEVA, Nov. 24 -- 3D-MICROMAC AG (Technologie-Campus 809126 Chemnitz) filed a patent application (PCT/EP2025/062192) for "METHOD FOR PRODUCING A MICROSTRUCTURED COMPONENT HAVING A LAYER STRUCTURE" on May 05, 2025. With publication no. WO/2025/237710, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEICHSENRING, Torsten (Zwickauer StraBe 6108134 Wildenfels), ALBERT, Sven (Obersteinbacher Strasse 2209322 Penig), CLAIR, Maurice (Reichenhainer StraBe 24209125 Chemnitz), GRIMM, Michael (Berganger 3809116 Chemnitz), KEIPER, Be...