INTERNATIONAL PATENT: 3D GLASS SOLUTIONS, INC., SCIPERIO, INC. FILES APPLICATION FOR "ENHANCED YIELD 3D HETEROGENEOUS INTEGRATION PACKAGING AND ASSEMBLY STRUCTURE AND METHOD"

GENEVA, Nov. 5 -- 3D GLASS SOLUTIONS, INC. (5601-B Balloon Fiesta Parkway NEAlbuquerque, NM 87113), SCIPERIO, INC. (Graseby Bldg, 12151 Research Pkwy #150Orlando, FL 32826) filed a patent application (PCT/US2025/026105) for "ENHANCED YIELD 3D HETEROGENEOUS INTEGRATION PACKAGING AND ASSEMBLY STRUCTURE AND METHOD" on Apr 24, 2025. With publication no. WO/2025/226894, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MCWETHY, Kyle (3911 Rancho Centro NwAlbuquerque, NM 87120), FLEMMING, Jeb H. (2817 Santa Monica SEAlbuquerque, ...