GENEVA, Aug. 18 -- 2PI-LABS GMBH (UniversitatsstraBe 15044801 Bochum) filed a patent application (PCT/EP2025/052802) for "MULTILAYER PRINTED CIRCUIT BOARD MODULE" on Feb 04, 2025. With publication no. WO/2025/168553, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): JAESCHKE, Timo (Am Waldesrand 745525 Hattingen), KUEPPERS, Simon (Am Kirschbaum 1644879 Bochum)
Abstract:
The invention relates to a multilayer printed circuit board module, in particular for high-frequency and/or radar applications. The multilayer circuit bo...