ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,878, issued on Dec. 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Physically-informed multi-system hardware operating ... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. D1,107,683, issued on Dec. 30, was assigned to Apple Inc. (Cupertino, Calif.). "Headset" was invented by Robert D. Brunner (Glen Ellen, Calif.) an... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,253, issued on Dec. 30, was assigned to Canon K.K. (Tokyo). "Control method, storage medium, and information processing apparatus transmitt... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,507,822, issued on Dec. 30, was assigned to WINNERS GROUP INDUSTRIES COMPANY Ltd. (Guangxi Zhuang Autonomous Region, China). "Artificial christ... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,535, issued on Dec. 30, was assigned to Amberstone Biosciences Inc. (Laguna Hills, Calif.). "Compartmentalized assays of bispecific and mul... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,986, issued on Dec. 30. "Blockchain-based authentication system and method" was invented by Steven Ali Ghabel (Miami). According to the ab... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,514,093, issued on Dec. 30, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Min Oh Choi (Yo... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. D1,107,931, issued on Dec. 30, was assigned to Bjorn Capital Group LLC (Dover, Del.). "Elongated ice pod" was invented by Simon Bjoern-Henriksen (... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,224, issued on Dec. 30, was assigned to SUBARU Corp. (Tokyo). "Rotorcraft including circular wings" was invented by Kensuke Yoshimura (Toky... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,400, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor packages" was invented by Euns... Read More