ALEXANDRIA, Va., Dec. 31 -- United States Patent no. D1,107,527, issued on Dec. 30, was assigned to Ningbo Sucrose Electric Appliance Co. Ltd. (Ningbo, China). "Blow torch" was invented by Licong Yan... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,408, issued on Dec. 30, was assigned to MAXELL LTD. (Kyoto, Japan). "Camera-equipped portable information terminal" was invented by Hiroshi... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,507,876, issued on Dec. 30, was assigned to BEYEONICS SURGICAL LTD. (Haifa, Israel). "Systems and methods for imaging a body part during a medi... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,846, issued on Dec. 30, was assigned to The Yokohama Rubber Co. LTD. (Tokyo). "Tire" was invented by Hideki Nagasawa (Kanagawa, Japan) and ... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. D1,107,795, issued on Dec. 30, was assigned to The Procter & Gamble Co. (Cincinnati). "Oral care composition dispenser" was invented by Geraldine ... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,263, issued on Dec. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Ceramic electronic component" was invented by T... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,511,159, issued on Dec. 30, was assigned to Bank of America Corp. (Charlotte, N.C.). "System and method for providing mainframe resource utiliz... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,514,014, issued on Dec. 30, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan). "Semiconductor chip, manufacturing method for... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,151, issued on Dec. 30, was assigned to Honda Motor Co. Ltd. (Tokyo). "Inspection device, inspection method, and vehicle" was invented by Y... Read More
ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,884, issued on Dec. 30, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Method for manufacturing semiconductor structure... Read More