ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,430, issued on Sept. 30. "Waterproof thermal camera enclosure" was invented by Samuel Douglass Wilson (Bloomington, Ind.), Matthew David A... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,075, issued on Sept. 30, was assigned to SIGMASTAR TECHNOLOGY LTD. (Xiamen, China). "Electronic device and operation method thereof" was i... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,516, issued on Sept. 30, was assigned to Yung-Sheng Ho (Kaohsiung, Taiwan). "Fuel cell device" was invented by Yung-Sheng Ho (Kaohsiung, T... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,173, issued on Sept. 30, was assigned to TDK Corp. (Tokyo). "Magnetic film, magnetoresistive effect element, and method for manufacturing ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,760, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method and apparatus for controlling UE tr... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,144, issued on Sept. 30, was assigned to Huawei Technologies Co. Ltd (Shenzhen, China). "Multi-channel audio signal encoding and decoding ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,722, issued on Sept. 30, was assigned to MediaTek Inc. (Hsinchu, Taiwan). "Image processing method and image processing device" was invent... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,415, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Buffer block structures for C4 bo... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,925, issued on Sept. 30, was assigned to RTX Corp. (Farmington, Conn.). "Radio frequency interface to sensor" was invented by Jonathan Gil... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,984, issued on Sept. 30, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices including stack structures having... Read More