ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,028, issued on July 1, was assigned to Mueller International LLC (Atlanta). "Hydrant nozzle cap spacer" was invented by Daryl Lee Gibson (Ch... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,653, issued on July 1, was assigned to Taisys Technologies Co. Ltd. (Taipei, Taiwan). "Method and system for decentralized identity generati... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,611, issued on July 1, was assigned to Dell Products LP (Round Rock, Texas). "Inflight-I/O-based storage emulation system" was invented by S... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. PP36,791, issued on July 1, was assigned to Syngenta Crop Protection AG (Basel, Switzerland). "Catharanthus plant named 'CARZ0004'" was invented by... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,888, issued on July 1, was assigned to QUALCOMM Inc. (San Diego). "Depth guided lift, shoot, splat for converting camera images to bird's ey... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,317, issued on July 1, was assigned to JPMORGAN CHASE BANK N.A. (New York). "Systems and methods for providing a semantic query framework" w... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,993, issued on July 1, was assigned to OMRON Corp. (Kyoto, Japan). "Terminal block and control device" was invented by Tomonori Watanabe (Ky... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,744, issued on July 1, was assigned to Glenfly Tech Co. Ltd. (Shanghai). "Parallel encoding and decoding method and apparatus, computer devi... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. D1,081,573, issued on July 1, was assigned to Webasto SE (Stockdorf, Germany) and Mitsuba Corp. (Kiryu, Japan). "Electric motor" was invented by We... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,742, issued on July 1, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "IC package with heat spreader" was invented by Rongwei Zhang (Plano... Read More