Japan, Jan. 20 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'INSPECTING METHOD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE.' Other related detail... Read More
Japan, Jan. 20 -- HOLOGIC INC has got intellectual property rights for 'SYSTEMS AND METHODS FOR AUTOMATED PREPARATION OF BIOLOGICAL SPECIMENS.' Other related details are as follows: Application Numbe... Read More
Japan, Jan. 20 -- HIGASHI NIHON MEDICOM KK has got intellectual property rights for 'INFORMATION SHARING SYSTEM, INFORMATION SHARING METHOD, AND PROGRAM.' Other related details are as follows: Applic... Read More
Japan, Jan. 20 -- NCHAIN LICENSING AG has got intellectual property rights for 'METHOD AND SYSTEM FOR IMPLEMENTING BLOCKCHAIN.' Other related details are as follows: Application Number: JP,2024-12580... Read More
Japan, Jan. 20 -- LG DISPLAY CO LTD has got intellectual property rights for 'TOUCH DISPLAY APPARATUS.' Other related details are as follows: Application Number: JP,2024-114700 Category (FI): H10K59... Read More
Japan, Jan. 20 -- PANASONIC IP MANAGEMENT CORP has got intellectual property rights for 'DISPLAY CONTROL DEVICE, DISPLAY SYSTEM, GATEWAY DEVICE, COMMUNICATION SYSTEM, DISTRIBUTION SYSTEM, AND DISTRIBU... Read More
Japan, Jan. 20 -- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD has got intellectual property rights for 'ORGANIC COMPOUNDS, LIGHT-EMITTING ELEMENTS, AND DISPLAY PANELS.' Other... Read More
Japan, Jan. 20 -- HIROSHIMA UNIV,HIROSHIMA GAS KK has got intellectual property rights for 'METHOD FOR MANUFACTURING HYDROGEN GAS AND METHOD FOR MANUFACTURING CATALYST.' Other related details are as f... Read More
Japan, Jan. 20 -- YUPITERU CORP has got intellectual property rights for 'SYSTEM, PROGRAM, AND OTHERS.' Other related details are as follows: Application Number: JP,2024-106652 Category (FI): G08G1/... Read More
Japan, Jan. 20 -- SHENZHEN PANGO MICROSYSTEMS CO LTD has got intellectual property rights for 'DATA DOUBLE OVERSAMPLING METHOD, SYSTEM, DEVICE, AND STORAGE MEDIUM.' Other related details are as follow... Read More